Copper deposits obtained by pulsating overpotential regime with a long pause and pulse duration from sulfate solutions

Fatemeh Karimi Tabar Shafiei, Kourosh Jafarzadeh, Ali Reza Madram

Abstract


The morphologies of the copper deposits obtained by pulsating over­potential regime with prolonged pulse and pause durations from the solution of 0.15 M CuSO4 in 0.50 M H2SO4 at overpotentials lower, higher and belonging to the plateau of limiting diffusion current density were compared with those obtained by the same electrodeposition regime from solutions of 0.075 and 0.30 M CuSO4 in 0.50 M H2SO4 and 0.15 M CuSO4 in 0.25 and 1.00 M H2SO4 at overpotentials outside the plateau of limiting diffusion current den­sity. These samples were characterized by scanning electron microscopic (SEM) analysis and the cathodic polarization characteristics from solutions compared. Inc­reasing the Cu(II) concentration led to an increase in the limiting diffusion cur­rent density. Decreasing the H2SO4 concentration shifts both beginning and the end of the plateau of the limiting diffusion current density towards higher elec­trodeposition overpotentials. Also, electrodeposition in solutions of 0.15 M CuSO4 in 0.25 and 1.00 M H2SO4 led to the formation of morphological forms of copper deposits characteristic for electrodeposition of copper from higher CuSO4 or lower H2SO4 in solution at some higher overpotentials.


Keywords


electrodeposition; pulsating overpotential; morphology; copper

Full Text:

PDF (7,161 kB)

References


H.-C. Shin, J. Dong, M. Liu, Adv. Mater. 15 (19) (2003) 1610 (http//doi.org/10.1002/adma.20030516)

D. H. Nam, R. H. Kim, D. W. Han, H. S. Kwon, Electrochim. Acta 66 (2012) 126 (https://dx.doi.org/10.1016/j.electacta.2012.01.084)

S. Eugenio, T. M. Silva, M. J. Carmezim, R. G. Duarte, M. F. Montemor, J. Appl. Electrochem. 44 (2014) 455 (https://dx.doi.org/10.1007/s10800-013-0646-y)

T. N. Huan, Ph. Simon, G. Rousse, I. Genois, V. Artero, M. Fontecave, Chem. Sci. 8 (2017) 742 (https://dx.doi.org/10.1039/c6sc03194c)

B. J. Plowman, L. A. Jones, S. K. Bhargava, Chem. Commun. 51 (2015) 4331 (https://dx.doi.org/10.1039/c4cc06638c)

H. Singh, P. B. Dheeraj, Y. P. Singh, G. Rathore, M. Bhardwaj, J. Electroanal. Chem. 785 (2017) 1 (https://dx.doi.org/10.1016/j.jelechem.2016.12.013)

Y. Li, W-Z. Jia, Y-Y. Song, X-H. Xia, Chem. Mater. 19 (2007) 5758 (https://dx.doi.org/10.1021/cm071738j)

N. D. Nikolic, Lj. J. Pavolic, M. G. Pavolic, K. I. Popov, Electrochem. Acta 52 (2007) 8096 (https://dx.doi.org/10.1016/j.electacta.2007.07.008)

K. I. Popov, S. S. Djokic, N. D. Nikolic, V. D. Jovic, Electrodeposited Alloy Powders, Morphology of Electrochemically and Chemically Deposited Metals, Springer, Basel, 2016, p. 291 (https://dx.doi.org/10.1007/978-3-319-26073-0_8)

W. L. Tasi, P. C. Hsu, Y. Hwu, C. H. Chen, L. W. Chang, J. H. Je, H. M. Lins, A. Groso, G. Margaritondo, Nature 417 (2002) 139 (https://dx.doi.org/10.1038/417139a)

H. Zhang, Y. Ye, R. Shen, C. Ru, Y. Hu, J. Electrochem. Soc. 160 (2013) D441 (https://doi.org/10.1149/2.019310jes)

W. Zhang, C. Ding, A. Wang, Y. Zeng, J. Electrochem. Soc. 162 (2015) D365 (https://dx.doi.org/10.1149/2.0591508jes)

N. D. Nikolic, G. Brankovic, K. I. Popova, Mater. Chem. Phys. 125 (2011) 587 (https://doi.org/10.1016/j.elecom.2010.03.021)

N. D. Nikolic, G. Brankovic, Electrochem. Commun. 12 (2010) 740 (https://dx.doi.org/10.1016/j.elecom.2010.03.021)

N. D. Nikolic, Lj. J. Pavlovic, S. B. Kristic, M. G. Pavlovic, K. I. Popov, Chem. Eng. Sci. 63 (2008) 2824 (https://dx.doi.org/10.1016/j.ces.2008.02.022)

N. D. Nikolic, G. Brankovic, M. G. Pavlovic, Powder Techol. 221 (2012) 271(https://dx.doi.org/10.1016/j.powtec.2012.01.014)

N. D. Nikolic, G. Brankovic, Mater. Lett. 70 (2012) 11 (https://dx.doi.org/10.1016/j.matlet.2011.11.081)

N. D. Nikolic, K. I. Popov, Lj. J. Pavlovic, M. G. Pavlovic, Surface Coat. Technol. 201 (2006) 560 (https://dx.doi.org/10.1016/j.surfcoat.2005.12.004)

M. S. Chandrasekar, M. Pushpavanam, Electrochim. Acta 53 (2008) 3313 (https://dx.doi.org/10.1016/j.electacta.2007.11.054)

F. A. Lowenheim, Electroplating, McGraw-Hill Book Company, New York, 1978

N. D. Nikolic, , Zaštita materijala 51 (2010) 197

N. D. Nikolic, K. I. Popov, Lj. J. Pavlovic, M. G. Pavlovic, Sensors 7 (2007) 1 (https://dx.doi.org/10.3390/s7010001)

D. Grujicic, B. Pesic, Electrochim. Acta 47 (2002) 2901 (https://dx.doi.org/10.1016/s0013-4686(02)00161-5)

K. I. Popov, P. M. Zivkovic, B. Jokic, N. D. Nikolic, J. Serb. Chem. Soc. 81 (2016) 291 (https://dx.doi.org/10.2298/jsc150717076p)

N. D. Nikolic, K. I. Popov, Hydrogen co-deposition effects on the structure of electrodeposited copper, Modern Aspects of Electrochemistry, S. S. Djokic, Ed., Springer-Verlag, New York, 2010, p. 1 (https://dx.doi.org/10.1007/978-1-4419-5589-0_1)

M. M. Kamel, A. A. El-Moemen, S. M. Rashwan, A. M. Bolbol, Metals 6 (2017) 179

J. M. Casas, F. Alvarez, L. Cifuentes, Chem. Eng. Sci. 55 (2000) 6223 (https://dx.doi.org/10.1016/s0009-2509(00)00421-8)

N. D. Nikolic, V. M. Maksimovic, M. G. Pavlovic, K. Popov, J. Serb. Chem. Soc. 74 (2009) 689 (https://dx.doi.org/10.2298/jsc0906689n)

N. D. Nikolic, G. Brankovic, V. Maksimovic, J. Electoanal. Chem. 635 (2009) 111 (https://dx.doi.org/10.1016/j.jelechem.2009.08.005)

L. Avramovic, V. M. Maksimovic, Z. Bascarevic, N. Ignjatovic, M. Bugarin, R. Markovic, N. D. Nikolic, Metals 9 (2019) 2 (https://dx.doi.org/10.3390/met9010056)

N. D. Nikolic, P. M. Zivkovic, B. Jokic, M. G. Pavlovi, J. S. Stevanovci, Maced. J. Chem. Chem. Eng. 33 (2014)169 (https://dx.doi.org/10.20450/mjcce.2014.509).




DOI: https://doi.org/10.2298/JSC190712128S

Copyright (c) 2019 Journal of the Serbian Chemical Society

Creative Commons License
This work is licensed under a Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License.

IMPACT FACTOR 1.097
5 Year Impact Factor 1.023
(
138 of 177 journals)