Mechanical characterization of copper films electrodeposited under different mixing conditions

Ivana O Mladenović, Jelena S Lamovec, Vesna B Jović, Marko Obradov, Dana G Vasiljević-Radović, Nebojša D Nikolić, Vesna J Radojević

Abstract


Mechanical properties of systems consisting of copper coatings electrodeposited on both brass sheet (BS) and thick electrodeposited nickel coating (ED Ni) substrates have been investigated. Electrodeposition of copper coatings was performed with and without ultrasound assistance. Ultrasound application decreases RMS roughness of deposited Cu coating on both applied substrates, as obtained from non-contact AFM measurement. Coating roughness is highly dependent on substrate roughness, being the smallest for Cu coatings deposited on ED Ni substrate with the ultrasound mixing. The hardness and adhesion properties were characterized using Vickers microindentation test. Model of Korsunsky was applied to experimental data for determination the film hardness and the model of Chen-Gao was used for the adhesion evaluation. Introduction of ultrasonic agitation caused changes in the film microstructure, and consequently in the mechanical properties. Copper coatings on both substrates, have higher hardness when deposited from electrolyte with ultrasound agitation. Although the type of the substrate has the major influence on the adhesion strength, it can be said that Cu electrodeposition with ultrasonic mixing contributes to an increase in adhesion.


Keywords


Cu electrodeposition; ultrasonic agitation; composite hardness, film adhesion

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DOI: https://doi.org/10.2298/10.2298/JSC181003023M

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